Technical Capability
ItemsSpeci.Remark
Max panel size32” x 32”(800mm x 800mm)
Min trace width/ space (inner layer)4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer)5 mil(0.13mm)hole ring width
Min thickness(inner layer)4 mil(0.1mm)without copper
Inner copper thickness0.5~4 oz
Outer copper thickness0.5~6 oz
Finished board thickness0.4-3.2 mm
Board thickness tolerance control(±0.10 mm)±0.1 mm1~4 L
Finished board thicknes(±10%)±10%≥6 L
Inner layer treatmentBrown oxidation
Layer count Capability1-24 LAYER
Alignment between ML±2mil
Min drilling0.15 mm
Min finished hole0.1 mm
Hole precision±2 mil(±50 um)
Tolerance for Slot±3 mil(±75 um)
Tolerance for PTH±3 mil(±75um)
Tolerance for NPTH±2mil(±50um)
Max Aspect Ratio for PTH8:1
Hole wall copper thickness15-50um
Alignment of outer layers 4mil/4mil
Min trace width/space for outer layer4mil/4mil
Tolerance of Etching+/-10%
Thickness of solder mask(on trace)0.4-1.2mil(10-30um)
Thickness of solder mask(at trace corner)≥0.2mil(5um)
Thickness of solder mask(on base material)Finished thickness+1.2mil
Hardness of solder mask6H
Alignment of solder mask film±2mil(+/-50um)
Min width of solder mask bridge4mil(100um)
Max hole with solder plug0.5mm
Surface finishHAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP,
Max Nickel thickness for Gold finger280u"(7um)
Max gold thickness for Gold finger30u"(0.75um)
Nickel thickness in Immersion Gold120u---240u"(3um----6um)
Gold thickness in Immersion Gold1u"---5u"(0.025um----0.125um)
Impedance control and its tolerance50±10%, 75±10%,100±10% 120±10%
Trace Anti-stripped strength≥61B/in(≥107g/mm)
Bow and twist0.75%